Advanced Packaging Multi-Physics Modeling Engineer
About the Team: OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integ
What this role actually needs.
About the Team: OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integ Requirements: - Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications. - Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking. - Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking. - MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field. - Strong communication, cross-functional collaboration, and technical leadership skills To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations. Company context: OpenAI builds frontier AI systems, research infrastructure, and applied products for developers, enterprises, and global users.
What a strong candidate brings
These requirements are extracted from the source listing and normalized for UpJobz readers.
- Strong understanding of electro-thermal interactions and temperature-dependent electrical behavior in high-performance computing applications.
- Familiarity with advanced packaging design including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- Familiarity with advanced packaging technologies, design flows, materials, and manufacturing processes including CoWoS, EMIB, chiplets, HBM integration, and 3D stacking.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related technical field.
- Strong communication, cross-functional collaboration, and technical leadership skills To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.
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Advanced Packaging Multi-Physics Modeling Engineer is framed against UpJobz source checks, country scope, compensation visibility, and work-authorization signals so candidates can make a faster go/no-go decision.
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Compensation read
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Source: jobs.ashbyhq.com · Source ID: c4d36b49-a51d-41c3-83f4-f9e7caca556f · Confidence: 97/100 · Last checked: May 7, 2026
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